Pengaruh Konsentrasi Tembaga dan Rapat Arus terhadap Morfologi Endapan Elektrodeposisi Tembaga

Authors

  • Soleh Wahyudi Institut Teknologi Sains Bandung
  • Syoni Soepriyanto Institut Teknologi Bandung
  • Mohammad Zaki Mubarok Institut Teknologi Bandung
  • Sutarno Sutarno Universitas Jenderal Achmad Yani

DOI:

https://doi.org/10.24252/al-kimia.v7i2.7818

Abstract

Copper deposits have been obtained by the electrolysis method using copper sulfate and sulfuric acid. The effect of copper concentration and current density on the surface morphology of copper deposits and current efficiency have been studied. The variation of copper concentration is 0.04 M and 0.8 M and the variation of current density is 2-8 A/dm2. The copper deposits will be photographed macro, weighed and characterized by Scanning Electron Microscope (SEM) to determine the surface morphology of deposits and Energy-Dispersive X-ray spectroscopy (EDX) to determine the chemical composition of deposits. The surface morphology of copper deposits in the form of compact and without nodules was reached at copper concentration is 0.8 M and the current density is 2 A/dm2 with the average of current efficiency is 96%.

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Author Biographies

Soleh Wahyudi, Institut Teknologi Sains Bandung

Program Studi Teknik Metalurgi

Syoni Soepriyanto, Institut Teknologi Bandung

Program Studi Teknik Metalurgi

Mohammad Zaki Mubarok, Institut Teknologi Bandung

Program Studi Teknik Metalurgi

Sutarno Sutarno, Universitas Jenderal Achmad Yani

Program Studi Teknik Metalurgi

References

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Mubarok, M. Z., Aji, L. N. & Wahyudi, S. (2017). Sintesis Serbuk Tembaga Dengan Metode Elektrolisis: Studi Perilaku Elektrokimia Dan Karakterisasi Serbuk. Prosiding SENAMM X 2017 : 623-632.
Grujicic, D. & Pesic, B. (2002). Electrodeposition of copper: the nucleation mechanisms. Electrochimica Acta, 47 (18) : 2901-2912.
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Published

2019-12-29

How to Cite

Wahyudi, S., Soepriyanto, S., Mubarok, M. Z., & Sutarno, S. (2019). Pengaruh Konsentrasi Tembaga dan Rapat Arus terhadap Morfologi Endapan Elektrodeposisi Tembaga. Al-Kimia, 7(2), 198–207. https://doi.org/10.24252/al-kimia.v7i2.7818

Issue

Vol. 7 No. 2 (2019): DECEMBER

Section

Article

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